GOLD & SILVER PLATING
Silver plating is an electro-deposit process for electrical engineering and electronic applications. Unlike gold deposits, silver deposits tends to oxidize much easier, thus being often used as a less expensive alternative to gold.
IMMERSION GOLD
This process is primarily for electric, electronic and wire bonding applications. It plates a thin, gold deposit on electroless nickel. Masking is available for plating a specific area, an internal or external thread, as required.
Its characteristics include:
- Very good solderability;
- A bright, uniform deposit; and
- It does not tarnish.
SILVER PLATING
Silver plating is used for various applications in electrical, bearing surfaces, contacts, etc.
Its characteristics include:
- Excellent lubricity, ductility and solderability;
- A deposit density of 10.5 grams/cc;
- Hardness of 90-100 vickers;
- 99.9% pure silver; and
- Compliance with federal QQ-S-365, various AMS and individual company specification requirements.