GOLD & SILVER PLATING

Silver plating is an electro-deposit process for electrical engineering and electronic applications. Unlike gold deposits, silver deposits tends to oxidize much easier, thus being often used as a less expensive alternative to gold.

IMMERSION GOLD

This process is primarily for electric, electronic and wire bonding applications. It plates a thin, gold deposit on electroless nickel. Masking is available for plating a specific area, an internal or external thread, as required.

Its characteristics include:

  • Very good solderability;
  • A bright, uniform deposit; and
  • It does not tarnish.

SILVER PLATING

Silver plating is used for various applications in electrical, bearing surfaces, contacts, etc.

Its characteristics include:

  • Excellent lubricity, ductility and solderability;
  • A deposit density of 10.5 grams/cc;
  • Hardness of 90-100 vickers;
  • 99.9% pure silver; and
  • Compliance with federal QQ-S-365, various AMS and individual company specification requirements.